SMT peripherals NC120 Xizui automatic washing machine
1. Development of the electronic manufacturing industry
1. Smaller components: the rapid development of electronics
components made increasingly smaller and more common components
0402,0201 and large-scale use, smaller components also will soon
appear. The smaller components will require corresponding Mounter
Xizui be small, which gives Xizui cleaning has brought problems, if
large-scale Xizui can also alcohol vigorous washing, needle-hole
methods, Now, only a few small Xizui micron to do on the aperture.
When the plug phenomenon occurred, but scrapped.
2. A small space: It is now the size of electronic devices require
a more compact, more powerful, more intensive on-board components,
the pitch getting smaller and smaller, if the slightest deviation
at the last patch will not affect too much, but now may To embark
on a nearby pad, causing the rate of bad products increased.
3. The impact of lead-free: As a good lead solder in the activity,
if the patch at the slightest deviation, PCB adopted after the
reflow can also automatically correct over, but after the
lead-free, copper activity has weakened, if the patch to deviate ,
There is no chance the amendment.
Comprehensive terms. Require more and more high-precision patch,
the poor Hao Li, it may be a thousand miles to the absurd. Mounter
the design has a very high accuracy, but because of the influence
of various factors, making it greatly reduced the performance,
which Xizui not clean is also an important factor.
二. The traditional cleaning methods
1. Alcohol + wind gun
James alcohol use soft cloth to scrub, and then use the wind
blowing the gun.
Disadvantages: the use of a large number of artificial and can not
be cleaned Xizui lumen, if the alcohol into reflection in the plate
to the glue, will lead to reflection plate shedding fade.
2. Ultrasonic cleaning machines
This is the wider use of a method, low-cost, more efficient, but
also very obvious shortcomings, many chip manufacturers expressly
prohibited method.
Disadvantages: Xizui collision between each other, leading to a
major surface damage to the black coating. Cleaning of the
infiltration would lead to the loss-reflection. Xizui lumen can not
be cleaned.

